Name |
Description |
Temperature
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MSDS |
TDS |
NFC |
Fluoride-free, general-purpose system for soldering gold, silver and copper based alloys, as well as most steels. Works well with all gold and silver solders. The paste deposit is fluid and will spread when heated. Paste is nondrying and has exceptional shelf-life in excess of one year. Typical metal content is 65%. |
1000 - 1600°F |
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NFA |
Fluoride-free specialty system suitable for soldering gold, silver and copper based alloys, as well as most steels. Works well with all gold and silver solders. Paste deposit is restrictive, and will not spread when heated, allowing greater precision in soldering. Care must be taken in storage of this product since it will tend to dry out if left open. Shelf life is 6 months, but can be shorter or longer depending on care during use and storage. Typical metal content is 65%. |
1000 - 1600°F |
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