Paste is a combination of a brazing or soldering alloy that has been manufactured into a very fine powder, a suitable flux for the application, and a neutral liquid binder that holds everything together in a moderately thick paste.
Paste System
Description
Flux Working Range
Heat Source
T
F
I
R
AQC
This general-purpose system for soldering gold, silver and copper based alloys, as well as most steels. Works well with all gold and silver solders. The paste deposit is fluid and will spread when heated. Paste is nondrying and has exceptional shelf-life. Typical metal content is 65%.
1000-1600°F
538-871°C
•
•
DAVIK
Specialty system suitable for soldering gold, silver and copper based alloys, as well as most steels. Works well with all gold and silver solders. Paste deposit is restrictive, and will not spread when heated, allowing greater precision in soldering. Care must be taken in storage of this product since it will tend to dry out if left open. Typical metal content is 65%.
1000-1600°F
538-871°C
•
•
•
VIK
Specialty system suitable for soldering gold, silver and copper based alloys, as well as most steels. Works well with all gold and silver solders. Paste deposit is restrictive, and will not spread when heated, allowing greater precision in soldering. Care must be taken in storage of this product since it will tend to dry out if left open. Typical metal content is 91%.
1000-1600°F
538-871°C
•
•
•
•
VIB
Semi-restrictive liquid system for use in paintable solders for gold, silver and copper based alloys, as well as most steels. Solder paint must be stirred before use. Typical metal content of 75%.
1000-1600°F
538-871°C
•
•
•
•
DC
General purpose flux-free system for use under a reducing atmosphere. Fluid system, will spread when heated. Nondrying. Typical metal content of 91%.
No Flux
•
DA
Flux-free system for use under a reducing atmosphere. Restrictive, minimal paste spread when heated. Care must be taken in storage of this product since it will tend to dry out if left open. Maximum metal content of 91%.
No Flux
•
DB
Semi-restrictive liquid system for use in paintable solders for gold, silver and copper based alloys, as well as most steels. Solder paint must be stirred before use. Flux-free system for use under a reducing atmosphere. Typical metal content of 75%.
